Thermal Conductive Paste Maker with High Thermal Conductivity

Introducing global thermal conductive paste maker renowned for its exceptional CPU thermal paste solutions. Our flagship product, the TG-N909, sets the standard in thermal management with its outstanding thermal conductive paste properties. The TG-N909 is a high-performance thermal glue designed to optimize heat dissipation in electronic components. With a thermal conductivity rating of 9W/m•K, this advanced paste efficiently absorbs heat from high-wattage chips, improving the overall efficiency and longevity of your devices. Its non-silicone base ensures no environmental pollution, while the low thermal impedance and low thermal resistance contribute to superior thermal management. Please feel welcome to contact us.

Features

• High thermal conductivity
• Silicone oil free
• No overflow
• Low thermal impedance/thermal resistance
• Non-silicone base, no Environmental pollution
• TG-N909, launched by T-Global, is a non-silicon thermal conductive paste with a thermal conductivity of 9W/m•K. This high-performance material is free of siloxane, ensuring that there is no evaporation of silicone resin or precipitation of silicone oil. Its low thermal resistance allows it to effectively absorb the heat generated by high-wattage chips, thereby enhancing the efficiency and lifespan of electronic components.
• It is suitable for optical instruments and silicon-sensitive equipment, such as CPU, chip cooler, LED electrical appliances. Compared with common silicon-type thermal paste, it is like a whole new world, allowing you to use it without silicon oil volatilization. The worries of the future, as long as the general thermal paste can be used, will not worry too much. It will show its excellent thermal conductivity. Any heating element and the radiator can let it grow.

Product applications: 

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

As a leading provider of advanced thermal management solutions, we are proud to introduce our cutting-edge product, the TG-N909 Non-Silicone Thermal Conductive Paste. Engineered by T-Global, this high-performance thermal paste represents a significant advancement in thermal interface materials, specifically designed to meet the demanding needs of today’s electronic and high-tech applications.

The TG-N909 stands out in the market for its impressive thermal conductivity of 9W/m•K, ensuring efficient heat transfer from critical electronic components to heat sinks or other cooling solutions. Unlike traditional thermal pastes that rely on silicone-based compounds, TG-N909 is formulated without silicone oil, thereby eliminating concerns of silicone evaporation and potential contamination of sensitive equipment. This feature not only enhances the longevity of the paste but also contributes to a cleaner and more reliable thermal interface.

Our non-silicone paste offers superior performance with its low thermal impedance and resistance. This means it effectively manages the heat generated by high-wattage chips, thereby improving the efficiency and operational lifespan of various electronic devices. Ideal for use in optical instruments, silicon-sensitive equipment, CPUs, chip coolers, and LED appliances, TG-N909 provides a seamless solution for high-performance cooling needs.

In addition to its technical prowess, TG-N909 boasts minimal oil dispersibility and weight loss, ensuring long-term stability and consistent thermal performance. Its gray color and specific viscosity of 300±100 Pa·s make it easy to handle and apply, while its operating temperature range of -40 to +200 °C accommodates a broad spectrum of applications. With a volume resistivity exceeding 10¹³ Ohm-m, it also provides excellent electrical insulation.

The TG-N909 Non-Silicone Thermal Conductive Paste is designed to cater to a wide array of industries including 5G technology, aerospace, artificial intelligence (AI), automotive, consumer electronics, energy storage, industrial applications, medical devices, and many others. Our product is packaged in convenient pots to facilitate ease of use and application in various settings.

In summary, TG-N909 is not just a thermal paste; it is a breakthrough in thermal management technology. Its high thermal conductivity, silicone-free formulation, and exceptional performance make it an indispensable choice for enhancing the efficiency and reliability of modern electronic systems.